Wafer Thickness Distribution Measurement Device "TMS-2000"
Non-contact measurement of flatness with a repeatability of 1nm is possible!
The TMS-2000 is a super high-precision wafer thickness distribution measurement device with innovative hardware design and high resistance to environmental changes. It enables inline inspection of various wafer materials such as silicon (up to P+++), SiC, sapphire, glass, LiNb3, and SOI, allowing for a wide range of applications that take advantage of high throughput and compact size. It adopts a spiral scan method that balances high speed and high-density measurement. The compact design allows for space-saving placement. 【Features】 - Stable thickness measurement based on high resistance to environmental temperature changes and vibrations - Sub-nanometer repeat measurement accuracy - High flexibility in scanning methods to measure thickness distribution on the wafer surface - Measurement possible even when attached to jigs with light irradiation from one side - Differential analysis possible with multiple different wafers - Measurement of evaluation parameters compliant with SEMI standards *For more details, please download the PDF or feel free to contact us.
- Company：Santec Holdings Corporation
- Price：Other
